Electronic Potting / Encapsulation
Overview
Many potting applications have a specific set of design requirements. A design engineer should consider many factors in choosing the best electronic potting/encapsulant for a robust design. Some considerations are:
- Operating Moisture Environment
- Temperature Extremes
- Component and Housing Substrates
- Fragility of Solder Joints
- Allowable Time for Potting and Curing
- Thermal Dissipation Requirement
- Mechanical Toughness Requirement
Technical Data Sheets
Epoxy Systems – Good chemical resistance, excellent robustness and insulation properties
Polyurethane Systems – Two-part systems provide fast cures and flexibility for fragile components
Silicone Systems – High temperature service, very safe handling and highly flexible
