Photonics and Active Alignment

Overview

Active Alignment Adhesives are used in the precision assembly of Optical, Fiber, MEMS and Optoelectronic components. These adhesives will instantly provide a rigid cure, once components are optimally positioned in place, by using UV light. The curing of any unexposed or shadowed areas will then proceed quickly with moderate heat or longer ambient conditions.

The Polymark line of Active Alignment Adhesives has many advantages over competitive products:

• Ability to choose the Polymark product matching your UV Wavelength
• Excellent Adhesive Bonding and strength to nearly all common substrates
• Very low Coefficient of Thermal Expansion (CTE)
• Ability to Cure Deep into the adhesive with UV exposure
• Able to withstand 85% Humidity/85°C Temperature conditions
• Very Low Cure Shrinkage